Heat Sink Geometry Comparison for Energy Efficiency in Compact Electronics: Implications for Electricity Savings and CO₂ Emission Reduction

Abstract

The rising global demand for digital technology has increased electricity consumption across all levels of electronic usage, from household devices to large-scale data centers. Improving the energy efficiency of compact electronics is therefore essential for reducing power demand and lowering the CO₂ emissions associated with electricity generation. This study compares two copper heat sink geometries—fin-type and pin-type—to evaluate their influence on thermal management and energy-use effectiveness in a miniature Application-Specific Integrated Circuit (ASIC) device exposed to laminar airflow for heat dissipation. Laminar airflow at a speed of 0.5 m/s was selected to simulate typical compact electronic ventilation. Using infrared thermography and onboard sensing, the study examines how geometric variations affect heat dissipation, operational temperature, and computational efficiency under a constant 100 W load. Results show that the 9-pin heat sink significantly reduces MOSFET temperature and increases computational output compared to both the 3-fin design and baseline conditions without a heat sink. These improvements translate into lower thermal losses, enabling the device to operate more efficiently with reduced electrical strain. By demonstrating that simple, low-cost geometric enhancements can meaningfully decrease heat accumulation and improve energy efficiency, this research highlights a practical pathway for reducing electricity consumption and the associated CO₂ emissions generated from fossil-fuel-based power systems. Moreover, the design insights are supported by recent advances in pin-fin design and optimization, reinforcing their relevance for sustainable electronics.